Semiconductor processing method of providing electrical isolation between adjacent semiconductor diffusion regions of different field effect transistors and integrated circuitry having adjacent electrically isolated field effect transistors

ABSTRACT

A semiconductor processing method of providing electrical isolation between adjacent semiconductor diffusion regions of different field effect transistors includes, a) providing an electrically insulative device isolation mass between opposing active area regions, the insulative isolation mass having opposing laterally outermost edges; and b) providing a pair of electrically conductive transistor source/drain diffusion regions within the active area regions, one of the conductive source/drain diffusion regions being received within one of the active area regions and being associated with one field effect transistor, the other of the conductive source/drain diffusion regions being received within the other of the active area regions and being associated with another field effect transistor, the electrically conductive source/drain diffusion regions each having an outermost edge adjacent the insulative isolation mass, such source/drain diffusion regions edges being received within the respective active area regions spaced from the respective mass laterally outermost edges to space the transistor source/drain diffusion regions edges away from the isolation mass. Integrated circuitry having adjacent electrically isolated field effect transistors produced according to the method and other methods is also disclosed. The invention also contemplates spacing one electrically conductive (heavy implant) diffusion region of one of adjacent field effect transistors away from the device isolation mass. Regardless, preferred spacing of the implant from the device isolation is at least 0.01 micron.

RELATED PATENT DATA

This patent application is a continuation of U.S. patent applicationSer. No. 08/633,030, filed Apr. 16, 1996, entitled "SemiconductorProcessing Method of Providing Electrical Isolation Between AdjacentSemiconductor Diffusion Regions of Different Field Effect Transistorsand Integrated Circuitry Having Adjacent Electrically Isolated FieldEffect Transistors", naming Trung Tri Doan and Charles H. Dennison asinventors, and which is now U.S. Pat. No. 5,895,243 the disclosure ofwhich is incorporated by reference.

TECHNICAL FIELD

This invention relates to semiconductor processing methods of providingelectrical isolation between adjacent semiconductor diffusion regions ofdifferent field effect transistors and integrated circuitry havingadjacent electrically isolated field effect transistors.

BACKGROUND OF THE INVENTION

Implementing electric circuits involves connecting isolated devices orelectronic components through specific electrical paths. Whenfabricating integrated circuits from semiconductor materials, such assilicon, it must therefore be possible to isolate devices built into thesubstrate from one another. Such devices are subsequently electricallyinterconnected to create the specific circuit configurations desired.

A variety of techniques have been developed to isolate devices inintegrated circuits. Different integrated circuit types can requiresomewhat different isolation requirements. For example, PMOS and NMOSintegrated circuits require an isolation structure that prevents theestablishment of parasitic channels between adjacent transistor devices.MOS transistors are inherently self-isolated.

As long as the source-substrate and drain-substrate pn junctions areheld at reverse bias in MOS transistors, the drain current (I_(D))should only be due to current flow from source to drain through achannel under the gate. This further implies that no significant currentbetween adjacent MOS devices should exist if no channels exist betweenthem. However, the method by which the components of an integratedcircuit are interconnected involves the fabrication of conductive linesthat run across oxide in the regions between the transistors, typicallyreferred to as field oxide or field regions. Unfortunately, theseconductive lines have a tendency to form gates of parasitic MOStransistors, with the oxide beneath them forming a gate oxide and thediffused regions of separate transistors adjacent the field regionsacting as parasitic sources and drains. The threshold voltage of suchparasitic transistors is kept higher than any possible operating voltageso that spurious channels will not be inadvertently formed betweentransistor devices. Two techniques for increasing the threshold voltageare increasing the field-oxide thickness and raising the dopingconcentration of the bulk substrate area beneath the field oxide.

Typical prior art isolation technology is described with reference toFIGS. 1 and 2. Referring first to FIG. 1, a semiconductor wafer fragment10 is comprised of a bulk monocrystalline silicon substrate 12 and anisolating field oxide region 14 positioned between a pair of fieldeffect transistor devices 16 and 18. Such transistors each compriserespective gate constructions 20, composed of a conductive portion 21,an underlying gate dielectric layer 22, and opposing insulating sidewallspacers 23. Each transistor is provided with a pair of electricallyconductive n+ source/drain diffusion regions 24 and 25. Example dopantconcentration for regions 24 and 25 is 1×10²⁰ ions/cm³ or greater. Bulksubstrate or well area 12 is provided to a p-concentration, such as1×10¹⁵ ions/cm³. Transistors 16 and 18 are also provided with n-lightlydoped drain (LDD) regions 26. Example concentration for regions 26 is1×10¹⁷ ions/cm³. Immediately beneath field oxide region 14, an implanthas been conducted to provide a higher concentration of p-type material,indicated by the plurality of "+" symbols therebeneath. Such effectivelyraises the threshold voltage for preventing a parasitic transistor fromforming beneath oxide 14 utilizing the adjacent regions 24 and 25 asparasitic sources and drains.

FIG. 2 illustrates an alternate prior art isolation process, referred toas buried-oxide (BOX) isolation technology. Like numerals are utilizedfrom the first described embodiment where appropriate, with differencesbeing indicated with different numerals or with the suffix "a".Buried-oxide isolation technology typically uses shallow trenches 28formed within bulk substrate 12 which are refilled with a chemical vapordeposited SiO₂ layer 30. This layer is then etched back to yield theillustrated planar upper surface 31.

This invention comprises improved techniques for providing electricalisolation between adjacent semiconductor diffusion regions of differentfield effect transistors.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below withreference to the following accompanying drawings.

FIG. 1 is a diagrammatic sectional view of one prior art semiconductorwafer fragment at a prior art processing step, and is discussed in the"Background" section above.

FIG. 2 is a diagrammatic sectional view of one prior art semiconductorwafer fragment at a prior art processing step, and is discussed in the"Background" section above.

FIG. 3 is a diagrammatic sectional view of a semiconductor waferfragment at one processing step in accordance with the invention.

FIG. 4 is a view of the FIG. 3 wafer fragment at a processing stepsubsequent to that shown in FIG. 3.

FIG. 5 is a diagrammatic sectional view of an alternate embodimentsemiconductor wafer fragment at one alternate processing step inaccordance with the invention.

FIG. 6 is a diagrammatic sectional view of another alternate embodimentsemiconductor wafer fragment at another alternate processing step inaccordance with the invention.

FIG. 7 is a view of the FIG. 6 wafer fragment at a processing stepsubsequent to that shown by FIG. 6.

FIG. 8 is a view of the FIG. 6 wafer fragment at a processing stepsubsequent to that shown by FIG. 7.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This disclosure of the invention is submitted in furtherance of theconstitutional purposes of the U.S. Patent Laws "to promote the progressof science and useful arts" (Article 1, Section 8).

In accordance with one aspect of the invention, a semiconductorprocessing method of providing electrical isolation between adjacentsemiconductor diffusion regions of different field effect transistorscomprises the following steps:

providing an electrically insulative device isolation mass betweenopposing active area regions, the insulative isolation mass havingopposing laterally outermost edges; and

providing a pair of electrically conductive transistor source/draindiffusion regions within the active area regions, one of the conductivesource/drain diffusion regions being received within one of the activearea regions and being associated with one field effect transistor, theother of the conductive source/drain diffusion regions being receivedwithin the other of the active area regions and being associated withanother field effect transistor, the electrically conductivesource/drain diffusion regions each having an outermost edge adjacentthe insulative isolation mass, such source/drain diffusion regions edgesbeing received within the respective active area regions spaced from therespective mass laterally outermost edges to space the transistorsource/drain diffusion regions edges away from the isolation mass.

In accordance with another aspect of the invention, integrated circuitryhaving adjacent electrically isolated field effect transistorscomprises:

an electrically insulative device isolation mass received betweenopposing active area regions, the insulative isolation mass havingopposing laterally outermost edges; and

a pair of field effect transistors, one field effect transistor beingreceived within one active area, the other field effect transistor beingreceived within the other active area;

a pair of electrically conductive transistor source/drain diffusionregions within the active area regions, one of the conductivesource/drain diffusion regions being received within the one active arearegion and being associated with the one field effect transistor, theother of the conductive source/drain diffusion regions being receivedwithin the other active area region and being associated with the otherfield effect transistor, the electrically conductive source/draindiffusion regions each having an outermost edge adjacent the insulativeisolation mass, such source/drain diffusion regions edges being receivedwithin the respective active area regions spaced from the respectivemass laterally outermost edges to space the transistor source/draindiffusion regions edges away from the isolation mass.

A first described embodiment is shown in FIGS. 3 and 4. Referring firstto FIG. 3, a semiconductor wafer fragment 32 in process is comprised ofa bulk semiconductor substrate 33. An electrically insulative fieldoxide region 34 has been grown within bulk substrate 33 to effectivelydefine an electrical isolation region 35 positioned between opposingsubstrate active area regions 37 extending laterally outward ofisolation region 35. For purposes of the continuing discussion, fieldoxide region 34 and the respective active area regions 37 join atrespective interface edges 36. A pair of transistor gates 41 and 43 areshown comprising respective conductive regions 38 and gate oxide regions40. Ion implanting is conducted to produce a pair of n- LDD diffusionregions 42 and 44 received within the respective active area regions 37.LDD diffusion regions 42 and 44 each have an outermost edge 45 adjacentand abutting against field oxide region 34.

Referring to FIG. 4, electrically insulating sidewall spacers 46 havebeen provided relative to conductive gate layer 38 and gate oxide layer40. A photoresist masking layer 48 has been deposited and patterned overfield oxide region 34. Photoresist mask 48 has lateral outermost edges50 spaced laterally outward within active area regions 37 beyond therespective interface edges 36.

With photoresist mask 48 in place, ion implanting of a conductivityenhancing dopant impurity is conducted into unmasked areas of substrateactive area regions 37 to a concentration effect to form a pair ofelectrically conductive transistors source/drain diffusion regions 52and 54. An example and preferred resultant implant concentration isagain greater than or equal 1×10²⁰ ions/cm³. Conductive source/draindiffusion region 52 is received within the left illustrated active arearegion 37 and is associated with field effect transistor gate 41.Conductive source/drain diffusion region 54 is received within the rightillustrated active area region 37 and is associated with field effecttransistor 43. Each region 52 and 54 has an outermost edge 55 adjacentfield oxide region 34. Such edges 55 are received within the respectiveactive area regions 37, but spaced from respective interface edges 36 tospace transistor source/drain diffusion regions edges 55 away from fieldoxide region 34.

The prior art heretofore has been understood to position suchelectrically conductive diffusion regions entirely against theintervening isolation field or trench oxide. Spacing such regionslaterally away from the isolation oxide in accordance with the inventionprovides the advantage of producing higher junction breakdown voltage,effectively higher field threshold voltage and improved punch-throughcharacteristics.

FIG. 5 illustrates an alternative embodiment 32a wherein even moreisolation is provided by not providing the LDD diffusion regions 42, 44against field oxide region 34. Such would however come at the added costof an additional masking step.

An alternate embodiment is described with reference to FIGS. 6-8. Firstwith reference to FIG. 6, there illustrated is a wafer fragment 60comprised of a bulk semiconductor substrate 62 having an outer surface64. A buried oxide electrically insulative device isolation mass 65 isprovided within bulk substrate 62 to define an electrical isolationregion 66 positioned between opposing substrate active area regions 67extending laterally outward thereof. Insulated isolation mass 65 and therespective active area region 67 join at respective interface edges 68.Buried oxide mass 65 projects outwardly of substrate outer surface 64,and includes sidewalls 70 which project substantially perpendicularlyfrom surface 64.

Gates 71 and 72 are provided, and respectively comprise a conductiveregion 73 and a gate oxide region 74. Ion implanting is preferablyconducted to provide the illustrated pair of LDD diffusion regions 75and 76. Such have outermost lateral edges 77 which abut insulation mass65.

Referring to FIG. 7, a layer of material 78 is provided over substrate62, buried oxide 65 projecting therefrom and its associated sidewalls70, and gate 71 and 72. Layer 78 preferably predominantly comprisesSiO₂. Alternately, layer 78 might comprise a nitride or material otherthan the same predominant composition of buried oxide electricallyinsulative device isolation mass 65.

Referring to FIG. 8, layer 78 is anisotropically etched to providesidewall spacers 80 over sidewalls 70 of buried oxide mass 65 projectingfrom substrate outer surface 64, and sidewall spacers 82 abouttransistor gates 71 and 72. Subsequent heavy ion implanting is conductedto produce the illustrated pair of electrically conductive transistorsource/drain diffusion regions 84 and 86 in a manner similar to thefirst described embodiment. Separate masking could also of course beconducted to provide no LDD diffusion region against electricallyinsulative device isolation mass 65.

The above described embodiments can facilitate provision of thinnerelectrically insulative device isolation masses between field effecttransistors. For example with respect to each of the above describedembodiments, the respective electrically insulative device isolationmasses have their lowest or innermost respective bases provided belowthe bases of the LDD regions, but not necessarily below the bases of theheavy doped source/drain diffusion regions. In other words, spacing ofthe highly conductive source/drain diffusion region laterally from thedevice isolation mass can be utilized in certain design application toeliminate deeper implanted or formed oxide.

Further, the above described preferred embodiments have been describedwith respect to oxide or device isolation masses formed relative to bulksemiconductor substrates, and provision of diffusion regions thereon.Alternate processing might be conducted apart from bulk semiconductorprocesing with formation of diffusion regions therein, with theinvention only being limited by the accompanying claims appropriatelyinterpreted in accordance with the doctrine of equivalence.

The invention also contemplates spacing one electrically conductive(heavy implant) diffusion region of one of adjacent field effecttransistors away from the device isolation mass. Regardless, preferredspacing of the implant from the device isolation is at least 0.01micron.

In compliance with the statute, the invention has been described inlanguage more or less specific as to structural and methodical features.It is to be understood, however, that the invention is not limited tothe specific features shown and described, since the means hereindisclosed comprise preferred forms of putting the invention into effect.The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

What is claimed is:
 1. A method for electrically isolating adjacentsemiconductor diffusion regions, comprising:providing a semiconductorsubstrate; forming an electrically insulative field oxide region withinthe semiconductor substrate, the field oxide region defining anelectrical isolation region which is positioned between two opposingsubstrate active areas, and wherein each of the opposing active areasand the field oxide region join at respective interface edges; afterforming the field oxide region, providing a photoresist mask over thefield oxide region, the photoresist mask having lateral outermost edgeswhich are positioned in spaced relation relative to the respectiveinterface edges, and within the respective active areas; and with thephotoresist mask in place, ion implanting a conductivity enhancingdopant impurity into the active area regions to form source/drainregions in each of the active areas, the source/drain regions having anoutermost edge being located within the respective active areas andspaced from the respective interface edges to locate the respectivesource/drain regions in spaced relation relative to the field oxideregion.
 2. A method as claimed in claim 1, and which furthercomprises:providing two discrete field effect transistors which arespace from one another and formed on the substrate, and wherein thefield oxide is provided between the two discrete field effecttransistors, and wherein each active area region is associated with oneof the discrete field effect transistors, and wherein the source/drainregions formed in each of the active areas are associated with one ofthe discrete field effect transistors.
 3. A method as claimed in claim1, and further comprising a LDD diffusion region which is receivedwithin each active area region and which is associated with each of thesource/drain regions, the LDD diffusion region having an outermost edgewhich abuts the field oxide region.
 4. A method as claimed in claim 1,and further comprising a LDD diffusion region which is received withineach active area region and which is associated with each of thesource/drain regions, the LDD diffusion region having an outermost edgewhich is spaced from the respective interface edges to space the LDDdiffusion region away from the field oxide region.
 5. A method asclaimed in claim 1, and further comprising:a LDD diffusion region whichis received within each active area region and which is associate witheach of the source/drain region, and wherein each of the LDD diffusionregions, source/drain regions, and the field oxide region have aninnermost base terminus, and wherein the innermost base terminus of thefield oxide region is positioned between the innermost base terminus ofeach of the LDD diffusion regions, and the innermost base terminus ofeach of the source/drain regions.
 6. A semiconductor processing methodof providing electrical isolation between adjacent semiconductordiffusion regions of different field effect transistors, the methodcomprising:providing a semiconductor substrate; growing an electricallyinsulative field oxide region within the semiconductor substrate todefine an electrical isolation region positioned between opposingsubstrate active area regions, the field oxide region and each of activearea regions having an innermost base terminus, and joining atrespective interface edges; after forming the field oxide region,providing a LDD diffusion region associated with each of the active arearegions, the LDD regions having an outermost edge which abuts the fieldoxide region, and an innermost base terminus; after forming the LDDregion, providing a photoresist mask over the field oxide and LDDregions, the photoresist mask having lateral outermost edges which arepositioned in spaced relation relative to the respective interfaceedges, and within the respective active areas; and with the photoresistmask in place, ion implanting a conductivity enhancing dopant impurityinto the active area regions to form source/drain diffusion regionswhich are individually associated with each of the respective fieldeffect transistors, each of the source/drain regions having an outermostedge which is spaced from the respective interface edges of the fieldoxide, and an innermost base terminus, and where the innermost baseterminus of the field oxide region is located between the innermost baseterminus of the LDD diffusion region and innermost base terminus of thesource/drain region.
 7. A method for electrically isolating adjacentsemiconductor diffusion regions, comprising:providing a semiconductorsubstrate having given active area regions; providing a buried oxideinsulative device within the semiconductor substrate and located betweentwo adjacent active area regions, the buried oxide insulative devicedefining an electrical isolation region between the two adjacent activearea regions, and wherein each active area region joins with the buriedoxide insulative device at respective interface edges, and wherein eachof the active area regions, and the buried oxide insulative device havean innermost base terminus; after providing the buried oxide insulativedevice, providing a LDD diffusion region associated with each activearea region, and wherein each LDD region abuts the buried oxideinsulative device, and further has an innermost base terminus; afterproviding the LDD diffusion region, providing a layer of material overthe substrate, buried oxide insulative device, and the LDD diffusionregion; after providing the layer of material, anisotropically etchingthe layer of material to provide spacers laterally outwardly of theburied oxide insulative device and over the LDD diffusion region; andafter forming the spacers, ion implanting a conductivity enhancingdopant impurity into the substrate active area regions to formrespective source/drain regions for each of the active area regions, andwherein each of the source/drain regions have an outermost edge receivedwithin the active area regions and spaced from the respective interfaceedges of the buried oxide insulative device, and further abutting theLDD diffusion region, and wherein the source/drain regions have aninnermost base terminus, and wherein the buried oxide insulative massinnermost base terminus is located between the innermost base terminusof the LDD diffusion region and the innermost base terminus ofsource/drain diffusion region.